GLOSSARY
Professional terminology definitions for tact switches, domes, connectors and FPCB industries. Each entry includes definitions, relevant parameters and usage scenarios to help engineers and technical buyers build accurate knowledge frameworks.
17 terms
also known as: tactile switchalso known as: 微动开关
A miniature electronic switch that produces a momentary contact closure signal when pressed. Typical structure includes plastic housing, metal dome (or membrane), moving contact and stationary contact. Features include short travel (0.1-0.5mm), low actuation force (50-300gf), long life (100K-1M cycles). Widely used in phones, remotes, industrial panels.
An independent tactile feedback element, typically a stamped stainless steel component in dome or cross shape. Produces a "click" tactile feel and closes circuit when pressed. Usually mounted on PCB or FPCB with key panel overlay. Available in diameters 3-12mm with actuation forces from 80gf to 400gf.
A flexible printed circuit board using polyimide (PI) or polyester (PET) as base material. Can be bent and folded, suitable for slim and irregularly shaped electronic products. Weijia's KEY FPCB integrates domes, connectors and adhesives onto FPCB to form complete key assembly solutions.
Assembly technology that solders components directly on PCB surface without through-holes. Reflow oven melts solder paste for electrical and mechanical connection. Advantages: high-density automated production. Disadvantages: weaker mechanical fixing, harder repair. SMT tact switches use tape-and-reel packaging.
Mounting method where component leads are inserted into PCB through-holes and fixed by wave soldering or hand soldering. Offers stronger mechanical fixing and vibration resistance than SMT but uses more space and isn't suitable for high-density assembly. Some industrial-grade tact switches offer DIP versions for harsh environments.
also known as: CRalso known as: Rc
Resistance at the interface between two conductors, consisting of constriction resistance and film resistance. A key metric for evaluating switch/connector reliability. Measured via four-wire (Kelvin) method under dry-circuit conditions. Standard values: <100mΩ initial (Sn-plated), <30mΩ (Au-plated), <10mΩ (thick Au).
High-precision resistance measurement method eliminating test cable resistance. Uses two wires to inject constant current, two separate wires to measure voltage drop. True contact resistance calculated via Ohm's Law R=V/I, free from lead resistance interference. The standard method for milliohm-level contact resistance measurement.
also known as: FPalso known as: 触发力度also known as: 按压力
The minimum force required to transition a tact switch from open to closed state. Typically expressed in gf (gram-force). Consumer electronics commonly use 100-160gf, industrial equipment 160-260gf, automotive ≥200g. Selection must consider user comfort, false-trigger protection and application scenario.
also known as: RPalso known as: 回弹力
Residual feedback force maintained after tact switch actuation (at bottom of travel). Typically 15-40% of FP. Higher RP means clearer tactile feel; too low may cause "no-feel" experience. Appears as the force valley after bottom-out on the F-D curve.
Characteristic curve describing the relationship between force and displacement during DOME or tact switch operation. Shows "peak-valley" shape: rising (compressing dome) → peak (FP, trigger point) → falling (dome snap) → valley (RP, bottom-out) → rising (release). Curve shape directly determines tactile quality.
Dust/water protection rating standard defined by IEC 60529. Format IPXY: X (0-6) = dust protection (6=dust-tight), Y (0-9) = water protection (4=splash,7=temp immersion 1m/30min,8=continuous immersion). Common switch ratings: IP40 (indoor general), IP67 (outdoor/industrial), IP68 (underwater).
Moisture sensitivity level defined by JEDEC standard, assessing moisture sensitivity of plastic-packaged components. Level 1 (≤30°C/85%RH/168h unlimited shelf life) to Level 3 (260°C/10s reflow limit). Most tact switches are Level 3+, requiring moisture barrier bags + desiccant for storage.
Collection of electronic manufacturing industry standards published by IPC (Association Connecting Electronics Industries). Key standards relevant to switches/connectors: IPC/JEDEC J-STD-020 (MSL classification), J-STD-001 (solderability), J-STD-003 (plating spec), IPC-6012 (rigid PCB acceptance).
Quality management system standard published by ISO. Requires companies to establish full-process QMS covering design, procurement, production, inspection and service, verified by third-party audit. Weijia Electronics is ISO 9001 certified with complete incoming, process and product inspection systems.
Standard packaging form for SMT components. Components are embedded in carrier tape sealed with cover tape, wound into reels for automatic pickup by SMT placement machines. Standard tape widths: 8mm, 12mm, 16mm, 24mm etc., quantity per reel depends on component size (500-5000pcs/reel). All Weijia SMT switches use this packaging.
A transparent or translucent film material that converts LED point light sources into uniform surface illumination. Commonly used in slim keyboards, appliance panels and automotive interior lighting. Weijia offers custom LGF services integrated with DOME and FPCB assemblies.
Probability distribution model widely used in reliability engineering. Used to analyze product life data, calculate characteristic life η (cycles at 63.2% failure probability) and shape parameter β (β<1 infant mortality, β≈1 random failure, β>1 wear-out). Life test report MTTF and reliability calculations are based on this distribution.
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